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MEMS-based thermoelectric infrared sensors: A review

Dehui XU, Yuelin WANG, Bin XIONG, Tie LI

Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4, Pages 557-566 doi: 10.1007/s11465-017-0441-2

Abstract:

In the past decade, micro-electromechanical systems (MEMS)-based thermoelectric infrared (IR) sensors have received considerable attention because of the advances in micromachining technology. This paper presents a review of MEMS-based thermoelectric IR sensors. The first part describes the physics of the device and discusses the figures of merit. The second part discusses the sensing materials, thermal isolation microstructures, absorber designs, and packaging methods for these sensors and provides examples. Moreover, the status of sensor implementation technology is examined from a historical perspective by presenting findings from the early years to the most recent findings.

Keywords： thermoelectric infrared sensor CMOS-MEMS thermopile micromachining wafer-level package

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Special issue: Technologies for future high-efficiency industrial silicon wafer solar cells

Frontiers in Energy 2017, Volume 11, Issue 1, Pages 1-3 doi: 10.1007/s11708-016-0436-4

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Patterned wafer bonding using ultraviolet adhesive

Rui ZHUO, Guanglan LIAO, Wenliang LIU, Lei NIE, Tielin SHI

Frontiers of Mechanical Engineering 2011, Volume 6, Issue 2, Pages 214-218 doi: 10.1007/s11465-011-0130-5

Abstract:

The process of patterned wafer bonding using ultraviolet (UV) adhesive as the intermediate layer wasExperimental results indicate that patterned wafer bonding using UV adhesive is achieved under room temperaturePatterned wafer bonding using UV adhesive will have great potential in the fabrication of microfluidic

Keywords： ultraviolet (UV) adhesive intermediate layer patterned wafer bonding

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Antenna-in-Package (AiP) Technology

Yueping Zhang

Engineering 2022, Volume 11, Issue 4, Pages 18-20 doi: 10.1016/j.eng.2021.08.012

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Multi-Component Resource Recycling from Waste Light-Emitting Diode Under Hydrothermal Condition: Plastic Package

Yongliang Zhang,Lu Zhan,Zhenming Xu,

Engineering doi: 10.1016/j.eng.2023.04.008

Abstract: Light emitting diodes (LEDs) have accounted for most of the lighting market as the technology matures and costs continue to reduce. As a new type of e-waste, LED is a double-edged sword, as it contains not only precious and rare metals but also organic packaging materials. In previous studies, LED recycling focused on recovering precious and strategic metals while ignoring harmful substances such as organic packaging materials. Unlike crushing and other traditional methods, hydrothermal treatment can provide an environment-friendly process for decomposing packaging materials. This work developed a closed reaction vessel, where the degradation rate of plastic polyphthalamide (PPA) was close to 100%, with nano-TiO₂ encapsulated in plastic PPA being efficiently recovered, while metals contained in LED were also recycled efficiently. Besides, the role of water in plastic PPA degradation that has been overlooked in current studies was explored and speculated in detail in this work. Environmental impact assessment revealed that the proposed recycling route for waste LED could significantly reduce the overall environmental impact compared to the currently published processes. Especially the developed method could reduce more than half the impact of global warming. Furthermore, this research provides a theoretical basis and a promising method for recycling other plastic-packaged e-waste devices, such as integrated circuits.

Keywords： Waste LED Hydrothermal treatment Recycling Plastic PPA degradation Packaging materials

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Antenna-in-package system integrated with meander line antenna based on LTCCtechnology

Gang DONG,Wei XIONG,Zhao-yao WU,Yin-tang YANG

Frontiers of Information Technology & Electronic Engineering 2016, Volume 17, Issue 1, Pages 67-73

Abstract:

We present an antenna-in-package system integrated with a meander line antenna based on low temperaturecircuit (IC) bare chips.A microstrip feed line is used to reduce the interaction between patch and packageThis antenna-in-package system integrated with a meander line antenna was fabricated and the experimental

Keywords： Antenna-in-package (AiP) Meander line antenna Multi-chip module (MCM) Low temperature co-fired ceramic

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Effects of taping on grinding quality of silicon wafers in backgrinding

Zhigang DONG, Qian ZHANG, Haijun LIU, Renke KANG, Shang GAO

Frontiers of Mechanical Engineering 2021, Volume 16, Issue 3, Pages 559-569 doi: 10.1007/s11465-020-0624-0

Abstract: Taping is often used to protect patterned wafers and reduce fragmentation during backgrinding of silicon wafers. Grinding experiments using coarse and fine resin-bond diamond grinding wheels were performed on silicon wafers with tapes of different thicknesses to investigate the effects of taping on peak-to-valley (PV), surface roughness, and subsurface damage of silicon wafers after grinding. Results showed that taping in backgrinding could provide effective protection for ground wafers from breakage. However, the PV value, surface roughness, and subsurface damage of silicon wafers with taping deteriorated compared with those without taping although the deterioration extents were very limited. The PV value of silicon wafers with taping decreased with increasing mesh size of the grinding wheel and the final thickness. The surface roughness and subsurface damage of silicon wafers with taping decreased with increasing mesh size of grinding wheel but was not affected by removal thickness. We hope the experimental finding could help fully understand the role of taping in backgrinding.

Keywords： taping silicon wafer backgrinding subsurface damage surface roughness

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Antenna-in-package system integrated with meander line antenna based on LTCC technology

Gang Dong, Wei Xiong, Zhao-yao Wu, Yin-tang Yang,gdong@mail.xidian.edu.cn

Frontiers of Information Technology & Electronic Engineering 2016, Volume 17, Issue 1, Pages 67-73 doi: 10.1631/FITEE.1500167

Abstract: We present an antenna-in-package system integrated with a based on technology.A microstrip feed line is used to reduce the interaction between patch and package.This antenna-in-package system integrated with a was fabricated and the experimental results agreed

Keywords： Antenna-in-package (AiP) Meander line antenna Multi-chip module (MCM) Low temperature co-fired ceramic

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Simulation of heterogeneous two-phase media using random fields and level sets

George STEFANOU

Frontiers of Structural and Civil Engineering 2015, Volume 9, Issue 2, Pages 114-120 doi: 10.1007/s11709-014-0267-5

Abstract: critical examination of existing random field models of heterogeneous two-phase media with emphasis on level-cutThe case of random level sets, often used to represent the geometry of physical systems, is also examined

Keywords： microstructure random fields level sets shape recovery two-phase media

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Experiment and optimal design of a collection device for a residual plastic film baler

Qi NIU,Xuegeng CHEN,Chao JI,Jie WU

Frontiers of Agricultural Science and Engineering 2015, Volume 2, Issue 4, Pages 347-354 doi: 10.15302/J-FASE-2015077

Abstract: The residual plastic film baler was designed as a package for film strip collection, cleaning and balingworking parameters for improving the collection efficiency of residual film and the impurity of film packageresults show that the factors affecting the collection rate of residual film and the impurity of the film package8°, respectively, the collection rate of residual film was 88.9% and the impurity of residual film package

Keywords： residual film collection device collection rate of residual film impurity of film package optimization

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The effect of sea level rise on beach morphology of caspian sea coast

M. A. Lashteh NESHAEI, F. GHANBARPOUR

Frontiers of Structural and Civil Engineering 2017, Volume 11, Issue 4, Pages 369-379 doi: 10.1007/s11709-017-0398-6

Abstract: Bed level elevations are measured and compared with the theoretical equilibrium profile.In the next stage, following extensive investigations, the bed level changes due to arise in sea levelThe mechanism of beach re-treatment due to a rise in sea level is considered based on the simplifiedComparison of the equilibrium profiles for different cases of sea level rise, clearly shows that becauseof the sediment transport induced by the fluctuation of the water level, the beach profile in the surf

Keywords： wave coastal zone beach morphology evolution equilibrium profile sea level rise

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Level set band method: A combination of density-based and level set methods for the topology optimization

Peng WEI, Wenwen WANG, Yang YANG, Michael Yu WANG

Frontiers of Mechanical Engineering 2020, Volume 15, Issue 3, Pages 390-405 doi: 10.1007/s11465-020-0588-0

Abstract: The level set method (LSM), which is transplanted from the computer graphics field, has been successfullyIn this study, a level set band method is proposed to overcome this drawback in handling topology changesin the level set framework.improve the continuity of objective and constraint functions by incorporating one parameter, namely, levelThe proposed method demonstrates a flexible topology change by applying a certain size of the level set

Keywords： level set method topology optimization density-based method level set band

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Research on the key technology of level pre-assembly of steel tower segments

Zhang Yongli,Gu Bifeng

Strategic Study of CAE 2010, Volume 12, Issue 4, Pages 48-52

Abstract:

In this paper, we researched the key technology of the level pre-assemblyLevel pre-assembly of steel tower fills the technology gaps in China and provides a strong basis for

Keywords： steel tower level pre-assembly support control apply level force

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Two-level uncapacitated lot-sizing problem considering the financing cost of working capital requirement

Yuan BIAN, David LEMOINE, Thomas G. YEUNG, Nathalie BOSTEL

Frontiers of Engineering Management 2020, Volume 7, Issue 2, Pages 248-258 doi: 10.1007/s42524-019-0069-5

Abstract: However, in literatures related to lot-sizing problem, WCR has only been studied in the single-levelIn this paper, we initially adopt WCR model for a multi-level case.A two-level (supplier–customer) model is established on the basis of the classic multi-level lot-sizingTo tackle this problem, we propose sequential and centralized approaches to solve the two-level case

Keywords： two-level ULS problem lot-sizing working capital requirement ZIO property infinite production capacity

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Understanding the demand predictability of bike share systems: A station-level analysis

Frontiers of Engineering Management Pages 551-565 doi: 10.1007/s42524-023-0279-8

Abstract: Divvy bike-share one-year data from Chicago, USA, we measured demand entropy and quantified the station-levelLastly, we identified that key factors contributing to station-level entropy and predictability includeBSS demand prediction, which can help decision makers and system operators anticipate diverse station-level

Keywords： bike share systems demand prediction prediction errors machine learning entropy